Bonding Process

ADRC Technology Introduction for ADRC process

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FPC Bonding
FPC : Flexible Print Circuit

ACF bonding
Temperature : 110 °C

TAB bonding
Temperature : 280 °C

Bonding procedure : ACF bonding → TAB bonding
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Driver measurement system
Company : Agilent
Model. No. : DSO6052A

500 MHz
Analogue 2ch.
Max. 8 Mpts Deep memory
100,000 wfms/s
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